JPH0568559B2 - - Google Patents

Info

Publication number
JPH0568559B2
JPH0568559B2 JP60254799A JP25479985A JPH0568559B2 JP H0568559 B2 JPH0568559 B2 JP H0568559B2 JP 60254799 A JP60254799 A JP 60254799A JP 25479985 A JP25479985 A JP 25479985A JP H0568559 B2 JPH0568559 B2 JP H0568559B2
Authority
JP
Japan
Prior art keywords
plating
anode
wafers
pair
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60254799A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62116800A (ja
Inventor
Seiichi Ichihara
Keiji Myamoto
Hiroaki Okudaira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Microcomputer System Ltd
Hitachi Ltd
Hitachi Microcomputer Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Microcomputer System Ltd, Hitachi Ltd, Hitachi Microcomputer Engineering Ltd filed Critical Hitachi Microcomputer System Ltd
Priority to JP25479985A priority Critical patent/JPS62116800A/ja
Publication of JPS62116800A publication Critical patent/JPS62116800A/ja
Publication of JPH0568559B2 publication Critical patent/JPH0568559B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP25479985A 1985-11-15 1985-11-15 めつき装置 Granted JPS62116800A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25479985A JPS62116800A (ja) 1985-11-15 1985-11-15 めつき装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25479985A JPS62116800A (ja) 1985-11-15 1985-11-15 めつき装置

Publications (2)

Publication Number Publication Date
JPS62116800A JPS62116800A (ja) 1987-05-28
JPH0568559B2 true JPH0568559B2 (en]) 1993-09-29

Family

ID=17270052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25479985A Granted JPS62116800A (ja) 1985-11-15 1985-11-15 めつき装置

Country Status (1)

Country Link
JP (1) JPS62116800A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7098220B1 (ja) * 2022-04-14 2022-07-11 株式会社日立パワーソリューションズ めっき装置およびめっき方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55119199A (en) * 1979-03-07 1980-09-12 Ngk Insulators Ltd Surface treatment apparatus for metal, etc.

Also Published As

Publication number Publication date
JPS62116800A (ja) 1987-05-28

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